CSC TP-US20 Ultra Soft - MH&W Thermal Products

Ultrasoft Gap FIller

  • Good thermal conductivity
  • Very Low hardness
  • Self sticky property
  • Low siloxane content

Applications

  • Memory Moduls (DDR, S-RAM)
  • Graphic Cards

  • Processors
  • BGA packages

  • Property Unit TP-US20
    Color blue
    Base Polymer Silicone
    Thermal Properties
    Thermal Conductivity W/mK 2.0
    Electrical Properties
    Dielectric Breakdown Voltage kV >5
    Dielectric Constant (@1kHz) 5.5
    Volume Resistivity Ohm cm 1013
    Mechanical Properties
    Thickness mm 1.0 – 5.0
    Density g/ccm 2.25
    Hardness Shore 00 15
    Young’s Modulus 163
    Tensile Strength MPa 0.1
    Physical Properties
    Application Frequency 100 MHz ~ 6G Hz
    Application Temperature °C -60 to +200
    Flame Class UL94 V0 [File No.: E258204]