are relatively thin and hard films made from a variety of materials with added fillers to increase the thermal conductivity. The main application for these type of thermal interface materials is as the interface between flat and smooth surfaces such as chips and heat sinks.
The thermal conductivity ranges between 1 and 6.5 W/mK covering a wide range of performance options.
The typical thickness is between 0.1 mm and 0.3 mm. As a consequence they are not capable of closing any gaps larger than that caused by waviness of the surfaces or tolerance stack up.
The hardness is measured on the Shore A scale with values in the 50 -100 range. While they do compress, they need higher compression forces to achieve optimal contact between the various surfaces.
They show good electrical isolation performance in the 4 – 30 kV/mm dielectric breakdown voltage range.
Best application areas for thermal films are:
✓ Transistor packages
✓ CPU, GPU
✓ IC packages
✓ Hard disks
✓ Power converters
✓ High voltage applications
We offer standard films from the following manufacturers: