Gap Filler Liquids - MH&W Thermal Products

Ceramic-filled two-component silicone elastomers offer a new and unique way to apply thermal interface materials without any stress on the covered components.  The possible application with hand held tools or automatic dispensing equipment allows the use in small and large production volumes. In addition, the curing at room temperature allows for “Wet-in-wet” production of even the most delicate components.

Customer specific solutions for the compound technology and processing technology is our strength. Kerafol has worked with the manufacturers of modern dispensing technologies allowing the application of heat conducting material onto the most diverse heat sinks or custom-specific components. Just Contact Us and we will be happy to help you in finding a solution.

Available in 50ml syringes, larger cartridges and cans.

 

Applications

  • RD-RAM Modules
  • Chipsets
  • memory chips

  • heat pipe thermal solutions
  • micro BGA
  • high voltage electronic components

  • Property Symbol Unit GFL 3020 GFL 3025 GFL 3030 GFL 3040
    Base Material     silicone silicone silicone silicone
    Color     yellow orange green lilac
    Mixing Ratio     1:1 1:1 1:1 1:1
    Viscosity   Pas 45 – 70 30 – 60 50 – 80 55 – 85
    Curing     1h; RT 1h; RT 1h; RT 1h; RT
    Technical Properties
    Thermal Resistance Rth K/W 0.7 0.5 0.41 0.29
    Thermal Conductivity l W/mK 1.8 2.5 3.0 4.0
    Breakdown Voltage Ud;ac kV 10.0 8.0 6.0 5.0
    Dielectric Breakdown Ed;ac kV/mm 20.0 16.0 12.0 10.0
    Measured thickness   mm 0.5 0.5 0.5 0.5
    Hardness   Shore 00 45 – 60 65 – 85 65 – 85 65 – 85
    Physical Properties
    Application Temperature   °C -40 to +200 -40 to +200 -40 to +200 -40 to +200
    Density r g/cm³ 2.3 2.83 2.94 3.05
    Total mass loss (TML)   Ma-% 0.19 <0.09 <0.06 <0.09
    Flame rating   UL-94 V-0 V-0 V-0 V-0
    Possible thickness   mm 0.2 – 5.0 0.2 – 5.0 0.2 – 5.0 0.2 – 5.0