Sealing Compounds - MH&W Thermal Products

Ceramic-filled one-part and two-component silicone elastomers. Because of their various thermal conducting capacities and their differing compressibility behaviors, their good dielectric properties and the absence of any solvents, these materials are ideally suitable for encapsulating or dispensing. The wide range of different material viscosities makes this product of interest for “Wet-in-wet” production.

Customer specific solutions for the compound technology and processing technology is our strength. Kerafol’s modern dispensing technologies allows the application of heat conducting material onto the most diverse heat sinks or custom-specific components. Just Contact Us and we will be happy to help you in finding a solution.

Tubes available from 5ml to 30ml

Applications

  • RD-RAM Modules
  • Chipsets
  • memory chips
  • heat pipe thermal solutions
  • micro BGA
  • high voltage electronic components
  • Property Symbol Unit GF 255 GF 300
    Base Material silicone silicone
    Color red blue
    Mixing Ratio 1:1 1:1
    Viscosity Pas 30 – 55 60 – 85
    Curing 30min; 120°C 30min; 120°C
    Technical Properties
    Thermal Resistance Rth K/W 0.83 0.41
    Thermal Impedance Rti °Cmm²/W
    Kin²/W
    243
    0.39
    120
    0.19
    Thermal Conductivity l W/mK 1.5 3.0
    Breakdown Voltage Ud;ac kV 4.0 7.0
    Dielectric Breakdown Ed;ac kV/mm 8.0 14.0
    Measured thickness mm 0.5 0.5
    Hardness Shore 00 10 – 25 40 – 55
    Density r g/cm³ 1.7 1.9
    Application Temperature °C -40 to +200 -40 to +200
    Possible thickness mm 0.2 – 4.0 0.2 – 3.0