Keratherm Sealing Compounds
Ceramic-filled one-part and two-component silicone elastomers. Because of their various thermal conducting capacities and their differing compressibility behaviors, their good dielectric properties and the absence of any solvents, these materials are ideally suitable for encapsulating or dispensing. The wide range of different material viscosities makes this product of interest for "Wet-in-wet" production.
Customer specific solutions for the compound technology and processing technology is our strength.
Tubes available from 5ml to 30ml
Applications
- RD-RAM Modules
- Chipsets
- memory chips
- heat pipe thermal solutions
- micro BGA
- high voltage electronic components
GF 255 and GF 300 Datasheet
Kerafol's modern dispensing technologies allows the application of heat conducting material onto the most diverse heat sinks or custom-specific components.
Just contact us and we will be happy to help you in finding a solution.
Properties
| Keratherm Sealing Compounds | ||||
|---|---|---|---|---|
| Property | Symbol | Unit | GF 255 | GF 300 |
| Base Material | silicone | silicone | ||
| Color | red | blue | ||
| Mixing Ratio | 1:1 | 1:1 | ||
| Viscosity | Pas | 30 - 55 | 60 - 85 | |
| Curing | 30min; 120°C | 30min; 120°C | ||
| Technical Values | ||||
| Thermal Resistance | Rth | K/W | 0.83 | 0.41 |
| Thermal Impedance | Rti | °Cmm²/W Kin²/W |
243 0.39 |
120 0.19 |
| Thermal Conductivity | l | W/mK | 1.5 | 3.0 |
| Dielectric Breakdown | Ed;ac | kV/mm | 1.5 | 1 |
| Measured thickness | mm | 0.5 | 0.5 | |
| Hardness | Shore 00 | 10 - 25 | 40 - 55 | |
| Density | r | g/cm³ | 1.7 | 1.9 |
| Application Temperature | °C | -40 to +200 | -40 to +200 | |
| Possible thickness | mm | 0.2 - 4.0 | 0.2 - 3.0 | |
