KoolBond™ Peel and Stick Thermal Interface
KoolBond™ Interface Material consists of a compliant metallized polymer matrix that is impregnated with a pressure-sensitive resin. The peel and stick silicone copolymer resin is compatible with chip mold release agents for additional strength. The metal matrix consists of a copper base and a nickel surface, which provides a corrosion barrier against aluminum.
Applications
- Low to Medium Power thermal solutions
- Controlling Boards
- BGA Applications
- Fastener-free Attachment
- RoHS compliant
Documents
Koolbond DatasheetGraphs (Click for full-size)
Thermal Impedance vs. Pressure for 5mil and 10 mil
Lap Shear Test Curves - 5mil
Lap Shear Test Curves - 10mil
Properties
| Koolbond™ Double Sided Thermal Adhesive Tape | ||||
|---|---|---|---|---|
| Property | Symbol | Unit | 5 mil | 10 mil |
| Color | gray | gray | ||
| Thermal Properties | ||||
| Thermal Conductivity | λ | W/mK | 0.66 | 0.64 |
| Thermal Impedance | Rti | °Cmm²/W Kin²/W |
270 0.42 |
480 0.74 |
| Electrical Properties | ||||
| Breakdown Voltage | Ud;ac | kV | not insulating | not insulating |
| Dielectric Breakdown | Ed;ac | kV/mm | - | - |
| Volume Resistivity | Ωcm | 2.42x10-3 | 2.42x10-3 | |
| Mechanical Properties | ||||
| Lap Shear Strength | N/cm² | 32.3 | 35.5 | |
| Overall Thickness | (±10%) | mm | 0.14 | 0.24 |
| Physical Properties | ||||
| Application Temperature | °C | -70 to +125 | -70 to +125 | |
| Shelf Life from D.O.M. | months | 12 | 12 | |
