KoolBond™
Peel and Stick Thermal Interface
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Description
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KoolBond™ Interface Material consists of
a compliant metallized polymer matrix that is impregnated with a pressure-sensitive
resin. The peel and stick silicone copolymer resin is compatible with
chip mold release agents for additional strength. The metal matrix
consists of a copper base and a nickel surface, which provides a corrosion
barrier against aluminum.
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Applications
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Low to Medium Power thermal solutions |
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Controlling Boards |
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BGA Applications |
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Fastener-free Attachment |
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RoHS compliant |
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Graphs
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Thermal Impedance vs.
Pressure for 5mil and 10 mil
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Lap Shear Test Curves
- 5mil |
Lap Shear Test Curves
- 10mil
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click
on image to
view full-sized
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KoolBond™: Peel
and Stick
Thermal Interface Material
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Unit
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5mil
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10mil
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| Color |
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gray
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gray
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| Thermal
Properties |
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W/mK
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0.66
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0.64
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°Cmm²/W
Kin²/W
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270
0.42
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480
0.74
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| Electrical
Properties |
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kV
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not insulating
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not insulating
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| Dielectric Breakdown |
Ed;ac
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kV/mm
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-
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-
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Wcm
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2.42x10-3
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2.42x10-3
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| Mechanical
Properties |
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N/cm2
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32.3
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35.5
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mm
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0.14
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0.24
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| Physical
Properties |
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°C
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-70 to +125
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-70 to +125
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months
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12
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12
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Datasheet
