CSC TP-S Series - MH&W Thermal Products

Gap Filler

  • Excellent thermal conductivity
  • Low hardness
  • Self sticky property
  • Low siloxane content
  • LS version has less than 50 ppm silicone content

Applications

  • Telecommunication Devices (Router)
  • Power Industries (SMPS)
  • Flat Panel Displays (PDP, LCD)
  • Property Unit TP-S10 TP-S15 TP-S20 TP-S25 TP-S30 TP-S30 LS
    *low silicone
    TP-S60
    Color black gray gray purple gray gray pink
    Base Polymer Silicone
    Thermal Properties
    Thermal Conductivity W/mK 1.0 1.5 2.0 2.5 3.0 3.0 5.3
    Electrical Properties
    Dielectric Breakdown Voltage kV >5
    Volume Resistivity Ocm >1013
    Mechanical Properties
    Thickness mm 0.5- 5.0
    Hardness Shore 00 45 45 45 45 45 55 60
    Tensille Strength N/mm² >.22 0.15
    Physical Properties
    Application Frequency 100 MHz ~ 6G Hz
    Application Temperature °C -60 to +200
    Flame Class UL94 V0 [File No.: E258204]

     

    * low silicone available on all materials