BTECHCORP has invented and patented a process for aligning high density fibers through the thickness of a polymer matrix . . . up to 20 million fibers per square inch.
Unique highly thermally conductive graphite fibers (1900 W/m°K) are used to create a Z-axis bulk thermal conductivity of 750 W/m°K (at 40% fiber volume) . . . twice the thermal conductivity of pure copper.
HM-2 Thermally Conductive Adhesive Film is currently being used or evaluated for a variety of Thermal Interface Material applications, including die attach, LED assembly, heat pipe attachment, heat sink attachment and production dice thermal test equipment. An on-going product improvement program (see PowerPoint presentation) has already demonstrated lower total thermal resistance and this will be incorporated into our production process in the near future. A combination of lower interface resistance and higher bulk conductivity will be needed to reach our HM-2 performance Goal.
HM-2 Application Bonding: See Thermoplastic Film Bonding Page, Section A. All instructions f or NTP/TP-3 also apply to HM-2 since they all use the same thermoplastic resin.
|Z-Axis Thermal Resistance||0.06°C-cm²/W (100μ thick bond)|
|Z-Axis Electrical Resistance||0.1-0.2 ohms (1.0 cm², 100μ thick)|
|Coefficient of Thermal Expansion||Z-Axis: 0 ppm/°C, X-Y plane: 45 ppm/°C|
|Young’s Modulus||X-Axis: 75 Ksi (0.45 GPa)
Y-Axis: 15 Ksi (0.09 GPa)
|Ionic Purity||Hydrolyzable Chloride <5 ppm
Hydrolyzable Sodium <2ppm
|Product Form||Film pre-form f or reel supply. 2-10 mils (0.05-0.25mm) thick, +/- 0.1 mil|
|Cure Cycle||100 psi bond compression (<3 sec) at 190°C (resin temperature)|
|Storage Life||6 months at 27°C (80°F)|